SK hynix and Sandisk launch the first HBF standard specifications, accelerating AI memory ecosystem adoption at FMS 2026

Executive summary: SK hynix announced the first HBF standard specifications alongside Sandisk at the Flash Memory Summit 2026, showcasing AI memory solutions. The HBF standard targets higher bandwidth and lower power for AI accelerators, potentially shaping future memory procurement for data centers and edge AI devices.

Who is involved: SK hynix (Executive VP Kim Chun‑sung, VP Kang Uk‑song), Sandisk, with ecosystem partners Google and Tenstorrent noted.

Likely next: Expect broader industry adoption of HBF, follow‑on product launches from memory vendors, and potential standardization discussions in JEDEC or similar bodies.

At the Flash Memory Summit 2026, SK hynix unveiled the inaugural specifications for the High Bandwidth Flash (HBF) standard, developed jointly with Sandisk. The initiative expands the HBF ecosystem, noting early participation from Google and Tenstorrent. By presenting AI‑focused memory solutions, the companies aim to meet growing demand for high‑performance, low‑latency storage in AI workloads.

Timeline

2026-08-04 — SK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at 'FMS 2026' (PR Newswire)
2026-07-27 — Longsys to Unveil "Edge AI Storage Fusion" at FMS 2026, Showcasing In-Depth Innovation in Edge AI Storage (PR Newswire)
2026-07-16 — ScaleFlux CEO to Deliver FMS 2026 Keynote with NVIDIA on Memory Solutions to Scale AI Data Pipeline (PR Newswire)

Analysis — what this means

Likely next events

HBF consortium launched around February 2026, six months before the August 2026 FMS showcase.
Google and Tenstorrent announced participation in the HBF ecosystem at the FMS 2026 keynote.

Sectors affected

AI memory modules
data center SSDs
edge AI storage

Historical parallels

JEDEC DDR5 standard release (2020)
NVMe 1.4 specification (2019)
HBM2E introduction (2020)

Key entities

Sources

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